Amphenol Advanced Sensors' NPP-301 series features silicon pressure sensors in a surface mount package. An ultra-small, silicon fusion bonded (SFB), ultra-high, stability SenStable^® piezoresistive chip from NovaSensor^® is placed in a plastic package. This exploits high volume leadframe package technology to achieve a low cost sensor alternative for customers.

The NPP-301 series produces a voltage output that is linearly proportional to the input pressure. The user can provide NPP products with signal conditioning circuitry to amplify the output signal. The NPP-301 series is compatible with most non-corrosive gases and dry air.