Power Management Discretes

By Toshiba Semiconductor and Storage 69

Power Management Discretes

Toshiba has released two new load switch families, the ultra-low ON resistance TCK11xG and the low operating voltage TCK20xG. The new load switch ICs offer reverse current blocking and an over-thermal shutdown function. They can provide up to 2 A to 3 A of current, making them quite powerful for their small size.

The TCK111G and TCK112G feature ultra-low switch ON resistance, low quiescent current and a wide input voltage operation from 1.1 V to 5.5 V. Switch ON resistance is only 8.3 mΩ at 5.0 V and -1.5 A for load conditions. It also features an inrush current suppressing slew rate control driver and output auto-discharge function (offered as an option on the TCK112G). This is in a tiny chipscale package (1.0 mm x 1.5 mm, t: 0.5 mm) with 0.5 mm pitch.

The low-voltage load switches TCK206G, TCK207G, and TCK208G have smaller packages than the super-low RON family. They operate at voltages as low as 0.75 V, which makes them a good choice for being directly controlled by a low-voltage controller. They have an RON of approximately 18 mΩ, which is very low considering their even smaller chipscale package (0.9 mm x 0.9 mm, t: 0.5 mm) with 0.5 mm pitch.

For switches where voltage regulation is necessary, Toshiba provides low dropout (LDO) regulators. CMOS-LDO regulators have become the power management ICs of choice for mobile devices, as they enable a low profile, low supply current and low dropout. Toshiba's lineup of LDOs provides 200 mA to 300 mA of output current, with excellent noise-output and ripple rejection characteristics.

TCK111G and TCK112G Features
  • Low ON resistance:
    • RON = 8.3 mΩ (typ.) at VIN = 5.0 V, 1.5 A
    • RON = 8.4 mΩ (typical) at VIN = 3.3 V, 1.5 A
    • RON = 8.4 mΩ (typical) at VIN = 1.8 V, 1.5 A
    • RON = 8.5 mΩ (typical) at VIN = 1.1 V, 1.5 A
  • Wide input voltage operation: VIN = 1.1 V to 5.5 V
  • Reverse current blocking
  • Inrush current is limited by an internal slew rate control driver
  • Thermal shutdown function
  • Built-in auto-discharge (TCK112G)
  • Pull-down connection between control and GND
  • Ultra-small package: WCSP6C (1.0 mm x 1.5 mm, t: 0.5 mm (typical))
TCK111G and TCK112G Applications
  • Power management
  • Power delivery switch
  • Active standby
  • Low-quiescent power switch
  • Mobile phones
  • Tablet PCs
  • Portable audio players
TCK206G, TCK207G, and TCK208G Features
  • Low input voltage operation: V(IN)=0.75 V to 3.6 V
  • Low ON resistance:
    • RON = 18.1 mΩ (typical) at VIN = 3.3 V, 1.5 A
    • RON = 18.2 mΩ (typical) at VIN = 1.2 V, 1.5 A
    • RON = 18.4 mΩ (typical) at VIN = 0.75 V, 1.5 A
  • Reverse current blocking
  • Inrush current is limited by an internal slew rate control driver
  • Thermal shutdown function
  • Built-in auto-discharge (TCK207G and TCK208G)
  • Ultra-small package: WCSP6C (1.0 mm x 1.5 mm, t: 0.5 mm (typical))
TCK206G, TCK207G, and TCK208G Applications
  • Power management
  • Power delivery switch
  • Active standby
  • Low-quiescent power switch
  • Mobile phones
  • Tablet PCs
  • Portable audio players
Toshiba LDO lineup Features
  • TCR2Exx low-noise LDO <200 mA
  • TCR2DGxx performance LDO for minimal noise and ripple rejection <200 mA
  • TCR3DMxx low-noise LDO <300 mA
  • Variety of packaging from 0.8 mm x 0.8 mm 0.38 mm LGA to SOT-25
Toshiba LDO lineup Applications
  • Power management
  • Active standby
  • Low quiescent
  • Camera modules
  • Low-noise sensors
  • Mobile phones
  • Tablet PCs
  • Portable audio players

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