DH8900CC S LJW2

DH8900CC S LJW2
Mfr. #:
DH8900CC S LJW2
メーカー:
Intel
説明:
Chipsets 8900 Chipset Server FCBGA-942
ライフサイクル:
メーカー新製品
データシート:
DH8900CC S LJW2 データシート
配達:
DHL FedEx Ups TNT EMS
支払い:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
詳しくは:
DH8900CC S LJW2 詳しくは
製品属性
属性値
メーカー:
インテル
製品カテゴリ:
チップセット
JBoss:
Y
シリーズ:
8900
製品:
サーバーチップセット
チップセットシリーズ:
8900
タイプ:
PCH
コード名:
ケーブクリーク
埋め込みオプション:
埋め込み
PCIeリビジョン:
1.0
PCIe構成:
4 Lanes
統合グラフィックス:
グラフィックなし
USBポートの数:
6
SATAポートの数:
2
TDP-最大:
8.5 W
最高作動温度:
+ 103 C
パッケージ/ケース:
FCBGA-942
包装:
トレイ
長さ:
27 mm
幅:
27 mm
ブランド:
インテル
取り付けスタイル:
SMD / SMT
CPU構成-最大:
2
感湿性:
はい
製品タイプ:
チップセット
ファクトリーパックの数量:
1
サブカテゴリ:
チップセット
USBリビジョン:
2.0
パーツ番号エイリアス:
923820
Tags
DH8900CCS, DH8900C, DH8900, DH890, DH89, DH8
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
Communication Chipset 942-Pin FC-BGA Tray
***ical
Communications Chip 942-Pin FCBGA Tray
*** Electronic Components
Chipsets 8900 Chipset Server FCBGA-942
Server Chipsets
Intel's Server Chipsets provides extensive I/O support with functions and capabilities that include PCI Express, PCI Local Bus, ACPI power management, enhanced DMA controller, Serial ATA, USB host interface, integrated 10/100/1000 Gigabit Ethernet MAC, and system management bus (SMBus) with additional support for I2C devices. These chipsets provide support for Intel High Definition Audio, Rapid Storage Technology, Active Management Technology, Virtualization Technology for Directed I/O, Trusted Execution Technology, Flexible Display Interconnect, Anti-Theft Technology, and JTAG Boundary Scan support.Learn More
89xx Communication Chipsets
Intel's 89xx Communication Chipsets are a platform controller hub (PCH) that includes standard PC interfaces (e.g., PCI Express, SATA, USB, etc.) along with Intel QuickAssist Technology and I/O interfaces. The PCH can be accessed by the IA processor via two interfaces: a DMI interface that provides connectivity to the standard PC interfaces and a PCI Express interface that provides connectivity to the PCH's PCI Express End Point (EP) for Intel QuickAssist Technology and access to the GbE MACs. These interfaces are not dependent on one another and can be used independently in a system.Learn More
モデル メーカー 説明 ストック 価格
DH8900CCS LJW2
DISTI # V99:2348_07313339
Intel CorporationPlatform Controller Hub Tray
RoHS: Compliant
1
  • 200:$43.3800
  • 50:$44.8000
  • 10:$46.3000
  • 1:$47.8900
DH8900CC S LJW2
DISTI # C1S325900208823
Intel CorporationCommunications Chipset Tray
RoHS: Compliant
1
  • 1:$47.8900
DH8900CC SLJW2
DISTI # DH8900CCS LJW2
Intel CorporationCommunication Chipset 942-Pin FC-BGA Tray - Trays (Alt: DH8900CCS LJW2)
RoHS: Compliant
Min Qty: 1
Container: Tray
Americas - 0
  • 1:$47.5900
  • 10:$46.9900
  • 25:$46.3900
  • 50:$45.7900
  • 100:$45.1900
  • 500:$44.5900
  • 1000:$43.9900
DH8900CC S LJW2
DISTI # 607-DH8900CCSLJW2
Intel CorporationChipsets 8900 Chipset Server FCBGA-942
RoHS: Compliant
7
  • 1:$49.2900
  • 10:$47.9400
  • 50:$46.6600
画像 モデル 説明
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Pin Fin, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum, Black Anodized
904-27-2-12-2-B-0

Mfr.#: 904-27-2-12-2-B-0

OMO.#: OMO-904-27-2-12-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0-WAKEFIELD

HEATSINK 27X27X12MM ELLIPTICAL
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0-WAKEFIELD

Elliptical Fin Heat Sink
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
可用性
ストック:
Available
注文中:
1989
数量を入力してください:
DH8900CC S LJW2の現在の価格は参考用です。最高の価格をご希望の場合は、お問い合わせまたは直接メールで営業チーム[email protected]までご連絡ください。
参考価格(USD)
単価
小計金額
1
$49.29
$49.29
10
$47.94
$479.40
50
$46.66
$2 333.00
200
$45.45
$9 090.00
2021年から半導体が不足しているため、2021年以前の通常価格以下の価格です。お問い合わせください。
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