S34ML02G100BHV000

S34ML02G100BHV000 Overview

Product belongs to the ML-1 series. Tray Alternate Packaging is the packaging method for this product SMD/SMT Mounting-Style Wide - 40 C to + 105 C operating temperature range for diverse applications BGA-63 Operational temperature range: -40°C ~ 105°C (TA) Interface: Parallel Voltage Supply Range: 2.7 V ~ 3.6 V Supplier device package: 63-BGA (11x9) This product comes with a 2G (256M x 8) memory size. FLASH - NAND memory type Operating frequency: 25ns The architecture of this product is Multiplane . This product uses FLASH memory for lightning-fast data processing. Parallel interface type 256 M x 8 Organization Capacity Maximum supply current: 30 mA The 8 bit. Maximum supply voltage of 3.6 V Minimum supply voltage is 2.7 V The product operates in Asynchronous mode.

S34ML02G100BHV000 Image

S34ML02G100BHV000 Specifications

• Manufacturer Cypress Semiconductor Corp
• Product Category Memory
• Series ML-1
• Packaging Tray Alternate Packaging
• Mounting-Style SMD/SMT
• Operating-Temperature-Range - 40 C to + 105 C
• Package-Case BGA-63
• Operating-Temperature -40°C ~ 105°C (TA)
• Interface Parallel
• Voltage-Supply 2.7 V ~ 3.6 V
• Supplier-Device-Package 63-BGA (11x9)
• Memory-Size 2G (256M x 8)
• Memory-Type FLASH - NAND
• Speed 25ns
• Architecture Multiplane
• Format-Memory FLASH
• Interface-Type Parallel
• Organization 256 M x 8
• Supply-Current-Max 30 mA
• Data-Bus-Width 8 bit
• Supply-Voltage-Max 3.6 V
• Supply-Voltage-Min 2.7 V
• Timing-Type Asynchronous

S34ML02G100BHV000 FAQ

• A: At what frequency does the Series?

  Q: The product Series is ML-1.

• A: Is the cutoff frequency of the product Packaging?

  Q: Yes, the product's Packaging is indeed Tray Alternate Packaging

• A: What is the Mounting-Style of the product?

  Q: The Mounting-Style of the product is SMD/SMT.

• A: At what frequency does the Operating-Temperature-Range?

  Q: The product Operating-Temperature-Range is - 40 C to + 105 C.

• A: At what frequency does the Package-Case?

  Q: The product Package-Case is BGA-63.

• A: Is the cutoff frequency of the product Operating-Temperature?

  Q: Yes, the product's Operating-Temperature is indeed -40°C ~ 105°C (TA)

• A: Is the cutoff frequency of the product Interface?

  Q: Yes, the product's Interface is indeed Parallel

• A: Is the cutoff frequency of the product Voltage-Supply?

  Q: Yes, the product's Voltage-Supply is indeed 2.7 V ~ 3.6 V

• A: What is the Supplier-Device-Package of the product?

  Q: The Supplier-Device-Package of the product is 63-BGA (11x9).

• A: What is the Memory-Size of the product?

  Q: The Memory-Size of the product is 2G (256M x 8).

• A: What is the Memory-Type of the product?

  Q: The Memory-Type of the product is FLASH - NAND.

• A: Is the cutoff frequency of the product Speed?

  Q: Yes, the product's Speed is indeed 25ns

• A: Is the cutoff frequency of the product Architecture?

  Q: Yes, the product's Architecture is indeed Multiplane

• A: Is the cutoff frequency of the product Format-Memory?

  Q: Yes, the product's Format-Memory is indeed FLASH

• A: What is the Interface-Type of the product?

  Q: The Interface-Type of the product is Parallel.

• A: What is the Organization of the product?

  Q: The Organization of the product is 256 M x 8.

• A: Is the cutoff frequency of the product Supply-Current-Max?

  Q: Yes, the product's Supply-Current-Max is indeed 30 mA

• A: What is the Data-Bus-Width of the product?

  Q: The Data-Bus-Width of the product is 8 bit.

• A: What is the Supply-Voltage-Max of the product?

  Q: The Supply-Voltage-Max of the product is 3.6 V.

• A: What is the Supply-Voltage-Min of the product?

  Q: The Supply-Voltage-Min of the product is 2.7 V.

• A: At what frequency does the Timing-Type?

  Q: The product Timing-Type is Asynchronous.