SIDC38D60C8X1SA1

SIDC38D60C8X1SA1
Mfr. #:
SIDC38D60C8X1SA1
メーカー:
Infineon Technologies
説明:
DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D60C8X1SA1)
ライフサイクル:
メーカー新製品
データシート:
SIDC38D60C8X1SA1 データシート
配達:
DHL FedEx Ups TNT EMS
支払い:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
製品属性
属性値
Tags
SIDC38, SIDC3, SIDC, SID
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***i-Key
DIODE GEN PURP 600V 150A WAFER
***ineon
Emitter Controlled Diode is Infineon's unique Fast Recovery Diode technology. The ultrathin wafer and Fieldstop technology makes the Emitter Controlled Diode ideally suited for consumer and industry applications as it lowers the turn-on losses of the IGBT with soft recovery. The Emitter Controlled Diode is optimized for Infineon IGBT technology. | Summary of Features: Soft, fast switching; Low reverse recovery charge; Small temperature coefficient | Target Applications: Industrial drives; Resonant applications
モデル メーカー 説明 ストック 価格
SIDC38D60C8X1SA1
DISTI # SIDC38D60C8X1SA1
Infineon Technologies AGDIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D60C8X1SA1)
RoHS: Compliant
Min Qty: 103
Container: Waffle Pack
Americas - 0
  • 103:$3.4900
  • 105:$3.2900
  • 208:$3.1900
  • 515:$3.0900
  • 1030:$2.9900
画像 モデル 説明
SIDC38D60C8X1SA1

Mfr.#: SIDC38D60C8X1SA1

OMO.#: OMO-SIDC38D60C8X1SA1-1190

DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D60C8X1SA1)
SIDC38D65C8AX7SA1

Mfr.#: SIDC38D65C8AX7SA1

OMO.#: OMO-SIDC38D65C8AX7SA1-1190

ブランドニューオリジナル
SIDC38D65C8X1SA1

Mfr.#: SIDC38D65C8X1SA1

OMO.#: OMO-SIDC38D65C8X1SA1-1190

Fast switching diode chip in EMCON 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D65C8X1SA1)
SIDC38D65C8X1SA1INFINEON

Mfr.#: SIDC38D65C8X1SA1INFINEON

OMO.#: OMO-SIDC38D65C8X1SA1INFINEON-1190

ブランドニューオリジナル
SIDC38D60C6X1SA3

Mfr.#: SIDC38D60C6X1SA3

OMO.#: OMO-SIDC38D60C6X1SA3-INFINEON-TECHNOLOGIES

DIODE GEN PURP 600V 150A WAFER
可用性
ストック:
Available
注文中:
5000
数量を入力してください:
SIDC38D60C8X1SA1の現在の価格は参考用です。最高の価格をご希望の場合は、お問い合わせまたは直接メールで営業チーム[email protected]までご連絡ください。
参考価格(USD)
単価
小計金額
1
$4.48
$4.48
10
$4.26
$42.61
100
$4.04
$403.65
500
$3.81
$1 906.15
1000
$3.59
$3 588.00
2021年から半導体が不足しているため、2021年以前の通常価格以下の価格です。お問い合わせください。
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