81026-660C04

81026-660C04
Mfr. #:
81026-660C04
メーカー:
3M
説明:
Headers & Wire Housings 26P TRIPOLAR HDR 4 WALL STRT SMT
ライフサイクル:
メーカー新製品
データシート:
81026-660C04 データシート
配達:
DHL FedEx Ups TNT EMS
支払い:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
製品属性
属性値
Tags
81026-660C, 81026-66, 81026-6, 81026, 8102, 810
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ark
Header Connector,pcb Mount,recept,26 Contacts,pin,0.05 Pitch,latch & Eject
***et
Conn Ejector Header HDR 26 POS 1.27mm Solder ST SMD Tray
***ied Electronics & Automation
80610463434 81026-660C04=26/MHDR/SMT/LEJINS/PST M
***lind Electronics
81026-660C0426/MHDR/SMT/LEJIN 80610463434
***erstate Connecting Components
26/MHDR/STR/EJ/SMT/SGLPST 80610463434
モデル メーカー 説明 ストック 価格
81026-660C04
DISTI # V36:1790_06601874
3M InterconnectConn Ejector Header HDR 26 POS 1.27mm Solder ST SMD Tray
RoHS: Not compliant
0
  • 1000000:$6.8960
  • 500000:$6.8990
  • 100000:$7.1190
  • 10000:$7.5040
  • 1000:$7.5680
81026-660C04
DISTI # 81026-660C04-ND
3M InterconnectCONN HEADER SMD 26POS 1.27MM
RoHS: Not compliant
Min Qty: 1000
Container: Bulk
Temporarily Out of Stock
  • 1000:$7.5677
81026-660C04-RB
DISTI # 81026-660C04-RB-ND
3M InterconnectCONN HEADER SMD 26POS 1.27MM
RoHS: Compliant
Min Qty: 200
Container: Tray
Temporarily Out of Stock
  • 200:$8.8652
81026-660C04-RB
DISTI # 05111530541
3M InterconnectConn Ejector Header HDR 26 POS 1.27mm Solder ST SMD Tray - Bulk (Alt: 05111530541)
RoHS: Compliant
Min Qty: 100
Container: Bulk
Americas - 83
  • 1000:$5.9161
  • 500:$6.0658
  • 300:$6.2234
  • 200:$6.3893
  • 100:$6.5644
81026-660C04
DISTI # 05113860767
3M InterconnectConn Ejector Header HDR 26 POS 1.27mm Solder ST SMD Tray - Bulk (Alt: 05113860767)
RoHS: Compliant
Min Qty: 1000
Container: Bulk
Americas - 0
  • 10000:$7.1900
  • 5000:$7.2900
  • 3000:$7.4900
  • 2000:$7.6900
  • 1000:$7.9900
81026-660C04
DISTI # 21K3669
3M InterconnectHeader Connector,PCB Mount,RECEPT,26 Contacts,PIN,0.05 Pitch,LATCH & EJECT0
  • 500:$9.7300
  • 250:$10.4200
  • 100:$11.2100
  • 50:$12.2400
  • 1:$13.4900
81026-660C04-RB
DISTI # 34P8585
3M Interconnect80001154204 81026-660C04-RB=26/MHDR/SMT/EJ/SGLPSTMT/30AVE/ROHS0
  • 1000:$8.3300
  • 500:$8.8600
  • 250:$9.5400
  • 100:$10.4100
  • 1:$12.7400
81026-660C04-RB.
DISTI # 24AC3433
3M Interconnect80001154204 81026-660C04-RB=26/MHDR/SMT/EJ/SGLPSTMT/30AVE/RO ROHS COMPLIANT: YES83
  • 1000:$8.3300
  • 500:$8.8600
  • 250:$9.5400
  • 100:$10.4100
  • 1:$12.7400
81026-660C04
DISTI # 517-81026-660C04
3M InterconnectHeaders & Wire Housings 26P TRIPOLAR HDR 4 WALL STRT SMT
RoHS: Not compliant
0
  • 1000:$7.5700
81026-660C04-RB
DISTI # 517-81026-660C04-RB
3M InterconnectHeaders & Wire Housings 26/MHDR/STR/EJ/SMT SGLPSTMT/30AVE/ROHS0
  • 1:$11.0300
  • 10:$10.5400
  • 25:$9.5800
  • 50:$9.1100
  • 100:$8.8700
  • 250:$7.9100
  • 500:$7.4300
  • 1000:$6.5700
81026-660C04-RB
DISTI # MMM7010349107
3M Interconnect7010349107 80001154204 26/MHDR/STR/EJ/SMT/SGLPSAmericas - 100
  • 1:$9.1404
  • 30:$7.8346
  • 60:$7.5935
  • 100:$7.5935
81026-660C04-RB
DISTI # MMM7010349107
3M Interconnect7010349107 80001154204 26/MHDR/STR/EJ/SMT/SGLPS100
  • 1:$9.1404
  • 30:$7.8346
  • 60:$7.5935
  • 100:$7.5935
画像 モデル 説明
81026-600C01

Mfr.#: 81026-600C01

OMO.#: OMO-81026-600C01

Headers & Wire Housings 26POS NO LATCH STR BOARDMT/TRIPOL HDR
81026-650301

Mfr.#: 81026-650301

OMO.#: OMO-81026-650301

Headers & Wire Housings 26P 4WL TRIPLR HDR SHRT EJECT STRT HDR
81026-560203-RB

Mfr.#: 81026-560203-RB

OMO.#: OMO-81026-560203-RB

Headers & Wire Housings R/ANGLE 26POS BOARDMT/TRIPOL HDR
81026-660C07-RB

Mfr.#: 81026-660C07-RB

OMO.#: OMO-81026-660C07-RB

Headers & Wire Housings 26P MHDR SMT
81026-660303

Mfr.#: 81026-660303

OMO.#: OMO-81026-660303-3M

Headers & Wire Housings 26P STRT 4WALL TRPLZ
81026-650C01

Mfr.#: 81026-650C01

OMO.#: OMO-81026-650C01-3M

Headers & Wire Housings 26/MHDR/SMT/STR/SEL INS/NO HOLES
81026-650C07

Mfr.#: 81026-650C07

OMO.#: OMO-81026-650C07-3M

Headers & Wire Housings 26P TRIPOLAR HDR 4 WALL STRT SMT
81026-M00203-RB

Mfr.#: 81026-M00203-RB

OMO.#: OMO-81026-M00203-RB-3M

Headers & Wire Housings 26 CON RT ANG .062"
81026-500203-RB

Mfr.#: 81026-500203-RB

OMO.#: OMO-81026-500203-RB-3M

Headers & Wire Housings 26P RA TRIPOL HDR NO LATCHES
81026-500303

Mfr.#: 81026-500303

OMO.#: OMO-81026-500303-3M

ブランドニューオリジナル
可用性
ストック:
Available
注文中:
5500
数量を入力してください:
81026-660C04の現在の価格は参考用です。最高の価格をご希望の場合は、お問い合わせまたは直接メールで営業チーム[email protected]までご連絡ください。
参考価格(USD)
単価
小計金額
1
$0.00
$0.00
10
$0.00
$0.00
100
$0.00
$0.00
500
$0.00
$0.00
1000
$0.00
$0.00
2021年から半導体が不足しているため、2021年以前の通常価格以下の価格です。お問い合わせください。
皮切りに
最新の製品
  • 588 Thermal Bonding Film
    3M™ 588 thermal bonding film is a high strength, flexible, nitrile phenolic based thermosetting adhesive film that is a thicker version of the 583 film.
  • Twin Axial Cables
    Available in four-channel, 100 Ω, 30 AWG versions, 3M™'s SL8800 series cable is the optimum solution for space-constrained systems.
  • D89 Series Socket Assemblies and 3365 Series Flat
    Digi-Key is expanding its extensive 3M™ value-added assembly program with ready-to-install IDC assemblies constructed with the D89 socket series.
  • Input/Output Interconnect System
    3M™'s I/O interconnect system allows designers flexibility in the location of power supplies to peripheral devices.
  • Mini Delta Ribbon Transmission Cable Assembly
    3M™'s MDR high-speed transmission system is a digital interconnect system designed to meet the needs of today's high-performance data transmission applications.
Top