Chip Quik

Chip Quik® small diameter solder spheres are available in both Sn63/Pb37 and Sn96.5/Ag3.0/Cu0.5 alloys in diameters as small as 0.008” (0.2 mm).

Chip Quik® flux removers and degreaser/contact cleaners are non-flammable and can be shipped and stored safely without requiring special handling.

Chip Quik® liquid flux in squeeze bottles allows precision dispensing onto circuit boards and larger work areas that can be slow to cover using a flux pen.

Chip Quik's 1 oz, 2 oz, and 4 oz solder wire spools are available in three popular alloys.

Chip Quik's pocket pack solder wire come in convenient 7" tubes that fit in a pocket for easy transport when a small amount of solder is needed on the job.

Chip Quik's aluminum soldering paste allows aluminum heat sinks and brackets to be soldered onto components in electro-mechanical assemblies.

Chip Quik’s discrete component jumper adapters are offered in a variety of surface mount package sizes for use in many applications.

Chip Quik’s indium solder wire low temperature melts at +143°C (+289°F), and its eutectic alloy is excellent for low-temperature soldering and sealing.

Chip Quik’s ultra-thin solder wire for soldering small electronic components combines a no-clean water-washable formula with an ultra-thin diameter format.

Chip Quik solder paste is good past its quoted shelf life, regardless of refrigeration. The solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal