Mill-Max

最新の製品
  • Compression Mount Spring-Loaded Connectors (SLC)

    Mill-Max's connectors with spring pins and active plungers are ideal for situations in which a soldered connection is not desirable or may not be possible.

    日にち: 2019-08-13
  • Solder Cup Connectors and Terminal Pins

    Mill-Max's solder cup components simplify the task of making wired connections between PCBs or devices and PCBs.

    日にち: 2019-07-12
  • Zero Profile Press-Fit Receptacles

    Mill-Max solderless press-fit receptacles have a precision machined, hexagon-shaped flange which is pressed into the PCB PTH until flush with the board surface.

    日にち: 2019-01-30
  • Press-Fit PCB Pins for Plated Through-Holes

    Mill-Max's PCB pins with venting features provide a secure, press-fit connection while maintaining plated through-hole integrity and continuity.

    日にち: 2018-11-08
  • Rugged, Spring-Loaded Wire Termination Connectors

    Mill-Max's 868 series connectors include solder-cups to accommodate wire and cable attachment along with flanged insulators and fastening options.

    日にち: 2018-11-08
  • Parallel Board-to-Board Connectors

    Mill-Max HSMT headers and sockets with removable plastic cap provide the convenience of a traditional connector and have a minimal surface mount profile.

    日にち: 2018-10-23
  • 380 Series Right-Angle Solder Cup Headers

    Mill-Max's 380 Series right-angle headers are ideal for situations where space is limited and wires cannot be easily manipulated.

    日にち: 2018-08-27
  • Super Low-Profile Sockets

    Mill-Max's super low-profile sockets are ideal for board stacking and wire to board applications where minimizing package height is paramount.

    日にち: 2018-05-15
  • 0.050" (1.27 mm) Pitch Solder Cup Headers and

    Mill-Max's 0.050" (1.27 mm) pitch solder cup headers and sockets are designed for termination of fine gauge wires and cables in a compact format.

    日にち: 2018-04-25
  • Low-Profile Removable Carriers for Male PCB Pins a

    Mill-Max presents its first male pin carrier, utilizing thin Kapton film to create ultra-low-profile interconnects.

    日にち: 2018-01-08
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