28-3570

28-3570-10 vs 28-3570-16 vs 28-3570-11

 
PartNumber28-3570-1028-3570-1628-3570-11
DescriptionIC & Component Sockets QUICK RELEASE 28 PIN HI TEMPIC & Component Sockets QUICK RELEASE 28 PIN NICKELIC & Component Sockets QUICK RELEASE 28 PIN GOLD
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsSockets for ICs, TransistorsSockets for ICs, Transistors
RoHSY--
ProductZero Insertion Force (ZIF) Sockets--
Number of Positions28 Position--
TypeDIPDIP, ZIF (ZIP), 0.3" (7.62mm) Row SpacingDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Termination StyleSolder Pin--
Contact PlatingTin--
SeriesX57X5757
BrandAries Electronics--
Mounting StylePCB--
Product TypeIC & Component Sockets--
Factory Pack Quantity10--
SubcategoryIC & Component Sockets--
Packaging-BulkBulk
Termination-SolderSolder
Operating Temperature---
Mounting Type-Through HoleThrough Hole
Features-Closed FrameClosed Frame
Housing Material-Polyphenylene Sulfide (PPS), Glass FilledPolyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins Grid-28 (2 x 14)28 (2 x 14)
Pitch Mating-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Mating-Nickel BoronGold
Pitch Post-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Post-Nickel BoronGold
Contact Finish Thickness Mating-50μin (1.27μm)10μin (0.25μm)
Contact Material Mating-Beryllium NickelBeryllium Copper
Contact Finish Thickness Post-50μin (1.27μm)10μin (0.25μm)
Contact Material Post-Beryllium NickelBeryllium Copper
Manufacturer Part # Description RFQ
Aries Electronics
Aries Electronics
28-3570-10 IC & Component Sockets QUICK RELEASE 28 PIN HI TEMP
28-3570-16 IC & Component Sockets QUICK RELEASE 28 PIN NICKEL
28-3570-11 IC & Component Sockets QUICK RELEASE 28 PIN GOLD
28-3570-10 IC & Component Sockets QUICK RELEASE 28 PIN HI TEMP
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