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| PartNumber | 28-3570-10 | 28-3570-16 | 28-3570-11 |
| Description | IC & Component Sockets QUICK RELEASE 28 PIN HI TEMP | IC & Component Sockets QUICK RELEASE 28 PIN NICKEL | IC & Component Sockets QUICK RELEASE 28 PIN GOLD |
| Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
| Product Category | IC & Component Sockets | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
| RoHS | Y | - | - |
| Product | Zero Insertion Force (ZIF) Sockets | - | - |
| Number of Positions | 28 Position | - | - |
| Type | DIP | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Termination Style | Solder Pin | - | - |
| Contact Plating | Tin | - | - |
| Series | X57X | 57 | 57 |
| Brand | Aries Electronics | - | - |
| Mounting Style | PCB | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 10 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Packaging | - | Bulk | Bulk |
| Termination | - | Solder | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | - | Through Hole | Through Hole |
| Features | - | Closed Frame | Closed Frame |
| Housing Material | - | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | - | 28 (2 x 14) | 28 (2 x 14) |
| Pitch Mating | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Mating | - | Nickel Boron | Gold |
| Pitch Post | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Post | - | Nickel Boron | Gold |
| Contact Finish Thickness Mating | - | 50μin (1.27μm) | 10μin (0.25μm) |
| Contact Material Mating | - | Beryllium Nickel | Beryllium Copper |
| Contact Finish Thickness Post | - | 50μin (1.27μm) | 10μin (0.25μm) |
| Contact Material Post | - | Beryllium Nickel | Beryllium Copper |