66-P

66-PLS11054-12 vs 66-PLS11049-12 vs 66-PGM11054-10

 
PartNumber66-PLS11054-1266-PLS11049-1266-PGM11054-10
DescriptionIC & Component SocketsIC & Component Sockets 66 PIN PGA GOLDIC & Component Sockets PIN GRID ARRAY SOLDER TAIL 66 PINS
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsSockets for ICs, TransistorsSockets for ICs, Transistors
ProductPGA Sockets--
Number of Positions66 Position--
TypeHandle on Left Side PGA Zero-Insertion Force Test & Burn-In SocketPGA, ZIF (ZIP)PGA
Pitch2.54 mm--
Termination StyleSolder Tail--
Contact PlatingGold--
Row Spacing---
Current Rating1 A--
Housing MaterialPolyphenylene Sulfide (PPS)Polyphenylene Sulfide (PPS)Polyamide (PA46), Nylon 4/6, Glass Filled
BrandAries Electronics--
Contact MaterialBeryllium Copper--
Flammability RatingUL 94 V-0--
Lead Length3.17 mm--
Mounting StyleThrough Hole--
Maximum Operating Temperature+ 125 C--
Minimum Operating Temperature- 65 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity1--
SubcategoryIC & Component Sockets--
Series-PLSPGM
Packaging-BulkBulk
Termination-SolderSolder
Operating Temperature--65°C ~ 125°C-55°C ~ 105°C
Mounting Type-Through HoleThrough Hole
Features-Closed Frame-
Number of Positions or Pins Grid---
Pitch Mating-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Mating-GoldGold
Pitch Post-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Post-TinTin
Contact Finish Thickness Mating-30μin (0.76μm)10μin (0.25μm)
Contact Material Mating-Beryllium CopperBeryllium Copper
Contact Finish Thickness Post-200μin (5.08μm)200μin (5.08μm)
Contact Material Post-Beryllium CopperBrass
Manufacturer Part # Description RFQ
Aries Electronics
Aries Electronics
66-PLS11054-12 IC & Component Sockets
66-PRS11054-12 IC & Component Sockets Sockets for ICs, Transistors - IC SOCKET ZIF
66-PLS11049-12 IC & Component Sockets 66 PIN PGA GOLD
66-PGM11054-10 IC & Component Sockets PIN GRID ARRAY SOLDER TAIL 66 PINS
Top