TE Connectivity’s (TE) LGA 3647 socket and hardware meet the next-generation designs for Intel- and AMD-based LGA microprocessor packages that range in size up to 3647 pins. This generation of LGA sockets provides a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.