By Wolfspeed 35
Wolfspeed's advanced SiC MOSFET technology is offered in low-inductance discrete packing. These packages allow engineers to take full advantage of the high-frequency capability of the latest C3M planar MOSFET chips. Designers can reduce component-count by moving from silicon-based, three-level topologies to simpler two-level topologies made possible by the improved switching performance. These devices feature low on-resistance combined with a low gate charge, making them ideally suited for three-phase, bridgeless PFC topologies as well as AC/AC converters and chargers.