Carrying FCC, IC and CE certifications and Bluetooth qualification, the BMD-300 module is ready to implement right away for IoT and wearable applications.
By Rigado 1048
Digi International's XBee-Pro® 900HP DigiMesh Kit is a great way to learn how to use XBee-Pro 900MHz RF modules that are ideal for sensor networking and device connectivity using the inno
By Digi International 630
Skyworks SKY13522-644LF, SKY13523-639LF, and SKY13524-639LF high isolation switches are designed for switching single-ended Rx SAW filters in cellular handsets.
By Skyworks Solutions Inc 2020
Microchip’s IoT Wi-Fi G AWS Internet of Thing (IoT) starter kit powered by Amazon Web Services uses a Wi-Fi G based module driven by a 32 bit controller.
By Microchip Technology 774
The 3M™ EMI absorber AB5000SHF series consists of flexible soft metal flakes, filler-loaded polymer resin, and acrylic pressure-sensitive adhesive.
By 3M 1325
Adafruit’s Feather M0 Wi-Fi development board is designed around an Microchip 32-bit ARM® Cortex®-M0+ processor with an Microchip FCC-certified ATWINC1500 802.
By Adafruit Industries 1327
NXP's NTAG I²C Plus NFC Tag Solution is designed to be the perfect enabler for NFC in home-automation and consumer applications. This feature-packed, next-generation connected NFC tag is
By NXP Semiconductors 881
Microchip's SAM B11 is an ultra-low power Bluetooth SMART (BLE 4.1) system on a chip with integrated MCU, transceiver, modem, MAC, PA, TR switch, and PMU.
By Microchip Technology 978
IDT introduced the industry's first single-pole, double-throw (SPDT) RF switch featuring its patent-pending KZ constant impedance technology.
By IDT, Integrated Device Technology Inc 613
Cypress' PSoC 4 BLE 256 KB device, two crystals for the antenna matching network, a PCB antenna and other passives, while providing access to all GPIOs of the device.
By Cypress Semiconductor Corp 959
Analog Devices’ HMC8038 and HMC7992 are non-reflective, 0.1 GHz to 6 GHz, silicon, SPDT and SP4T switches in 5 mm x 5mm LFCSP, surface-mount packages.
By Analog Devices Inc 678
Analog Devices' HMC930A GaAs, pHEMT, MMIC amplifiers inputs/outputs (I/Os) are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs).
By Analog Devices Inc 767
Analog Devices' HMC1166 is a MMIC, VCO that integrates a resonator, a negative resistance device, and a varactor diode, and features a half frequency output.
By Analog Devices Inc 583
Dialog Semiconductor's highly integrated, ultra low power SmartBond IoT sensor development kit helps designers create motion and environmental sensing modules.
By Dialog Semiconductor 1284
The Symphony Link Evaluation Board from Link Labs can be used for point-to-point communications and initial sensitivity assessments.
By Link Labs 1226
TDK’s IFL series Flexield products are flexible, shock-resistant noise suppression sheets made of soft magnetic material and resin for thin and compact devices.
By TDK Corporation 1368
GainSpan's GS2200MIZ is a very small footprint, fully integrated Wi-Fi module that provides manufacturers a way to add Wi-Fi connectivity to their products.
By GainSpan Corporation 1255
Cypress' EZ-BLE PSoC evaluation board enables you to evaluate and develop applications on the EZ-BLE PSoC Module and helps reduce time-to-market.
By Cypress Semiconductor Corp 808
SparkFun's Blynk board is specially designed to work with the ‘widgets’ within the Blynk mobile app to quickly and easily create your next IoT project.
By SparkFun Electronics 1656
Digi International's XBee SX modules provide a combination of reliability and redundancy for OEMs building low-power, mission-critical wireless devices.
By Digi International 1037