Cypress Semiconductor's CY8CKIT-062-WIFI-BT PSoC® 6 Wi-Fi+BT pioneer kit is ideal for engineers looking to develop innovative IoT embedded systems.
By Cypress Semiconductor Corp 859
Arduino's MKR WAN 1300 is a powerful board that combines the functionality of the MKR Zero and LoRa connectivity for IoT battery-powered projects.
By Arduino 1123
Arduino's MKR GSM 1400 is ideal for creating IoT battery-powered projects in a compact form factor for makers with minimal previous experience in networking.
By Arduino 1152
Thinxtra's Oyster™ is a low-profile, rugged GPS device designed to connect to the Sigfox Global network for tracking non-powered assets.
By Thinxtra Solutions Limited 982
Thinxtra's XKit Sigfox ready development kit has everything needed to hit the ground running using the globally available Sigfox network.
By Thinxtra Solutions Limited 1196
TDK's TPLC553030 series automotive transponder coil ensures high reliability suitable for automotive applications.
By TDK Corporation 1177
Semtech's SX1261 and SX1262 devices are designed for long-range wireless applications and support long battery life.
By Semtech 1519
Espressif’s ESP8266EX delivers highly integrated Wi-Fi SoC solutions to meet users’ constant demands for compact design, and efficient power use.
By Espressif Systems 1480
Fair-Rite’s engineering kits provide a comprehensive listing of material types and forms to fit any application.
By Fair-Rite Products Corp. 2072
Fair-Rite’s flexible ferrite sheets provide the benefits of soft-magnetic materials while freeing users from their mechanical constraints.
By Fair-Rite Products Corp. 1994
3M’s embossed copper foil shielding tape 1245 has a 1.4 mil embossed copper foil backing with acrylic pressure-sensitive adhesive and liner.
By 3M 1486
Nordic Semiconductor's nRF52840 multi-protocol SoC supports all Bluetooth low energy physical layer bit rates and modulation schemes.
By Nordic Semiconductor 1646
Wolfspeed's CMPA0060002F is a GaN HEMT MMIC distributed driver amplifier, which operates between 20 MHz to 6.0 GHz.
By Wolfspeed 752
ADI’s HMC1121 is a three-stage, GaAs, pHEMT, MMIC, 4 W power amplifier with an integrated temperature compensated on-chip power detector.
By Analog Devices Inc 770
Cypress Semiconductor's CYW20719 wireless MCU is an ultra-low-power dual-mode Bluetooth 5.0 compliant device enabling a variety of IoT applications.
By Cypress Semiconductor Corp 710
Rigado's multiprotocol SoM enables BLE5 and Thread connectivity, allowing faster time-to-market with reduced development cost.
By Rigado 1057
ADI’s HMC774ALC3B is a general-purpose, double balanced mixer that can be used as an upconverter or downconverter between 7 GHz and 34 GHz.
By Analog Devices Inc 688
The WSM-BL241-ADA-008 from Murata is a Bluetooth Low Energy/NFC module. It enables ultra-low power connectivity for data communication.
By Murata Electronics 1521
Ethertronics' EtherHelix line of Isolated Magnetic Dipole (IMD) GPS antennas delivers a reliable option.
By Ethertronics Inc 1169
Wurth Electronics' WE-LS conductive foam can be stamped or cut to very precise tolerances to fit custom enclosures, seams, or surfaces.
By Würth Elektronik 1180